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Assembly and Packaging Technologies

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­­Assembly and packaging technology involves all technological processes needed to produce electronic modules; starting from wafer dicing, to chip and wire bonding, through encapsulation and final test.

Modules Customized printed circuit board Monolith Endoscope camera Color sensor Board with chip Wafer Dicing Sample production Chip bonding

­­Assembly and packaging technologies:

  • Wafer dicing (Si, GaAs, glass, ceramics, FR4)
  • Chip bonding (photodiodes, LEDs, image sensors, monoliths)
  • Wire bonding (gold, aluminum)
  • Encapsulation (e.g. glob top, cover, filter, lens, glass)
  • Chip on board (Si, GaAs, glass, ceramics, FR4)
  • Optimized material selection­

­Applications:

 

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Optoelectronic Systems
Technical Support
+49 36482 45-206
+49 36482 45-226