Our chip processing technologies cover epitaxy, metallization of wafers, photolithography and separation of chips with wafer saws. The individual process steps are monitored and controlled by different quality assurance means (e.g. parameter acquisition).
We use various A3B5 semiconductor materials such as GaP, GaAs, and InGaAs.
The flexible combination of process steps and the adjustment of chip layouts allows for manufacturing customized LEDs and photodiodes with a capacity of up to 50 million chips per year.
We are producing photodiodes which are selective in the range from 150 nm to 1750 nm. Their advantages are very good signal-to-noise ratio, high temperature stability, low degradation of light current and good suppression of other spectral regions.
Our LEDs have a high efficiency in spectral ranges from 360nm to 1750 Nm and they are extremely stable against degradation. Their optical and electronic parameters are subject to only small fluctuations.
Typical fields of applications are health care and life science, safety technology, automation technology, as well as all areas of optical sensors.