Chip Processing

­­Our chip processing technologies cover epitaxy, metallization of wafers, photolithography and separation of chips with wafer saws. The individual process steps are monitored and controlled by different quality assurance means (e.g. parameter acquisition).

We use various A3B5 semiconductor materials such as GaP, GaAs, and InGaAs.
The flexible combination of process steps and the adjustment of chip layouts allows for manufacturing customized LEDs and photodiodes with a capacity of up to 50 million chips per year.

We are producing photodiodes which are selective in the range from 150 nm to 1750 nm. Their advantages are very good signal-to-noise ratio, high temperature stability, low degradation of light current and good suppression of other spectral regions.