System
• Glass format: min. 900mm x 600mm - max. 2600mm x 2600mm
• Glass thickness: min. 2mm - 6mm (further thichnesses on request)
• Positioning accuracy: + 0.2mm
• Cutting speed: max. 600mm/s
• Removal rate at edge deletion: max. 50 cm²/s
• Working height: 950mm + 20mm
The laser system can optionally be equipped with functional modules for
- selective layer removal (for CIS/CIGS substrates) for contact surface integration,
- laser drilling and
- laser cutting of glass substrates
We reserve the right to make changes in the interest of technical progress.