Chip Bonding

­­Chip bonding (also called die bonding) is the process needed to place and fix micro chips on the substrate for later electrical connections.

Typically, the micro chips are supplied on diced wafers or waffle packs from which they can be sorted and extracted by means of ejection pins and vacuum tools. The chips can be fixed and connected on the front and on the back (flip-chip).
We stamp or dispense epoxy on the substrate to fix the micro chips. Depending on the application, this adhesive can be electrically conductive or isolating.