Encapsulation

Encapsulation is­ a technology used to protect chip and wire bonded modules from external influences, such as temperature, humidity and mechanical damage.

There are different possibilities:

• Glass cover ­­

  This cover is mainly used for image and line sensors. The glass can be coated with filter and/or antireflection coatings.

• Encapsulation with optics­

  LEDs, photodio­des and image sensors can be covered with an optic with a very high accuracy.
  

• Optical casting ­­­

  ­This is also used with LEDs and photodiodes. Depending on the application either epoxides or silicones (clear or with filters) will be used.

• Glob top­

  This is the easiest way to cover modules. Glob top material will be released onto the component where it will cure.

• Optopackaging­

  ­The sensor will be covered with an optical component (lens or lens array). The cover can also be optical thin glass which can be adjusted with or without an air gap.