Lasers & Material Processing
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Laser machines for laser separating
Laser machines for dices up wafers into semiconductors chips
Laser machine JENOPTIK-VOTAN™ Semi 300
At the semiconductor “back end”, finished wafers are diced up into so-called “dies”. None of the known dicing technologies such as sawing or laser cutting fulfills all the requirements such as high throughput, high yield and excellent edge quality at the same time.
Based on the experience from glass and ceramics industries, Jenoptik has developed the TLS dicing system (Thermal Laser Separation) JENOPTIK-VOTAN Semi 300. The machine is characterized by achieving high yields at high throughputs and low operating costs. The laser machine JENOPTIK-VOTAN™ Semi 300 dices up wafers into semiconductor chips quickly, cleanly and with previously unequaled edge quality.
Laser machines for full cutting of display glass
Laser machine JENOPTIK-VOTAN™ Advanced
The JENOPTIK-VOTAN™ Advanced serves for the dicing of display panels from the parent substrates. The system can be equipped for the realization of two different processes: “thermal laser separation” (TLS) for scribing and breaking and the advanced technology “TLS advanced” for complete separation (full cut). This technology enables the complete separation of laminated glass panels.
Due to the special machine structure, the TLS advanced process is executed in a sequence within one procedure from both sides without rotating the substrates. Thanks to the elimination of the breaking process and due to the high cutting speed, very short cycle times can be achieved, the separation process practically being particle-free. The machine concept enables easy integration into fully automated process lines for displays up to size Gen9 or operation as a stand-alone system.
Laser machines for top-level processing of substrate ceramics
Laser machine JENOPTIK-VOTAN™ Compact 100
The JENOPTIK-VOTAN™ Compact 100 is a system providing top accuracy for separation in the series production of ceramic hybrid integrated circuits, passive components, multilayer ceramics (LTCC), thick and thin-film ceramics, zirconium oxide, DCB ceramics etc.
The process of thermal laser separation (TLS) enables practically damage and particle-free cutting of the material. Thus, the “clean” cutting step can take place at any stage in the production process. Consequentially, the TLS process is also suitable for scribing loaded ceramic hybrid integrated circuits at the end of the process chain, directly before breaking. The flexible design and uncomplicated operation enable easy integration in fully automated process lines or operation as a stand-alone system.