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JENOPTIK-VOTAN™ Solas 1800/3600
Our overall solutions
The JENOPTIK - VOTAN™ Solas 1800 / 3600 is adapted to fulfil all requirements from R&D system with a throughput of some 1,000 wafers per day to a entirely automated production solution with more than 3,600 wafers per hour.
Besides the integration into new production lines these machines are able to upgrade existing factories. The service friendly transport belt concept is adaptable to all customer wafer transportation concepts. Free selectable options and modular design enable a maximum in flexibility for the customers.
Advantages
- increasing cell efficiency
- contactless processing
- waferhandling without front side touching
- stable production process
- wear free laser tools
- low cost of ownership
Integration of different laser processes
MWT / EWT
Metal / Emitter Wrap Through
Front contact fingers are contacted with rear side bus bars through via laser drilled holes.
Advantages:
- damage free hole drilling
- no micro cracks
- no shadowing losses -> more active area
SED
Selective Emitter Doping
Diffuse and activate dopants with laser deep into poly -, mono - crystalline silicon wafers and formation of p / n junction with different profiles.
Advantages:
- processing time less than 2 seconds / wafer
- no measurable reduction of carrier lifetime
- no damage of texture
LADL
Laser Ablation of Dielectric Layer
Locally opening of dielectric layers with laser, e.g. SiN (ARC – antireflection coating).
Advantages:
- no thermal impact, cold ablation (without damaging or detectable melting silicon)
- no structural change of substrate
LEI
Laser Edge Isolation
Removal of the n - emitter by selective Laser ablation to avoid shortcircuits from front to back side.
Advantages:
- excellent quality of the isolation grooves without microcracks and bulging of molten mass
LFC
Laser Fired Contact
Laser alloying of rear side metal with silicon through passivation layer.
Advantages:
- excellent quality of the contact points
- high processing speed
TLS
Thermal Laser Separation
Cutting of wafers for individual formats or repairing.
Advantages:
- higher yield by reduced dicing street (zero kerf)
- clean process
- higher blocking voltage