Wire Bonding

­Wire bonding is the process of creating an electrical connection between micro chips with the help of bond wires. The wire will be welded to the chip and substrate using ultrasonic techniques.

The diameter for thin wire bonding can be chosen from 17 to 50 µm. As standard wire diameters we work with 25 µm for aluminum and gold wire. Aluminum and gold are commonly used as wire materials. Aluminum wire is processed at room temperature while external warming (80-220 °C) is supplied for gold wire bonding.