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New challenges for PIC testing

Photonic integrated circuits (PICs) are the chips of the future.

Photonic integrated circuits use light instead of electricity for data transmission and processing. PICs are manufactured in a variety of designs on wafers using classical lithography techniques and existing equipment from established semiconductor manufacturers. However, wafer testing presents its own unique challenges. Due to the additional optical components to be tested, the test throughputs are not yet as high as for established IC functional tests. Test solutions for visual inspection also still need to be procured and integrated. In addition, a complex realignment of the optical interfaces of the test equipment in the submicron range is required for each chip.
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04 October 2023
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PST
JENOPTIK, UFO Probe® Vertical – Leap forward in merging photonic and electric wafer-level test
Speaker: Tobias Gnausch, Product Manager SBU Semiconductor & Advanced Manufacturing / EPIC TechWatch at the ECOC 2023 in Glasgow, Scotland

Speed up the world

Thanks to Photonic Integrated Circuits (PICs), optics is becoming the key to fast data communication. The UFO Probe® Technology for PIC wafer-level testing is setting new standards, linking the present and the future.
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UFO Probe® Technology keeps you one step ahead

Testing of optical and electrical functionalities is a crucial factor in wafer production. In high-volume production, it is important to keep both test and setup times low in order to remain economical. This is where UFO Probe® technology offers the right solution, as it enables electrical and optical components of each chip to be tested simultaneously, thus saving time. It is based on a concept for optical scanning of photonic integrated circuits that is insensitive to wafer probers alignment tolerances. Jenoptik probe cards can therefore be used with commercially available wafer probers and ensure a correspondingly high throughput.

Built-in solution for high-volume production

The UFO Probe® Card enables simultaneous electrical and optical testing of chips on wafers with one single probe card. It can be integrated into existing test infrastructure for established electrical function tests - thus eliminating the need for expensive investments in stand-alone solutions.
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New Jenoptik UFO Probe® Vertical

ufo probe card vertical in detail

The consistent further development of the patented technology expands the possibilities of optical coupling and, with the new UFO Probe® Vertical version, enables parallel functional tests of optical as well as electrical components on chips using vertical needle technology from established test card manufacturers. This allows the user to couple up to 32 optical channels in parallel as standard - or more if required - without the need for active alignment.

The UFO Probe® Vertical:

  • Covers the entire wavelength range from 1260 to 1625 nanometres used in the telecommunications and data communications sector
  • Provides polarization preservation for individual or all optical channels
  • Contacting of up to 6000 bond pads/ of bondpads with dimensions down to 35 microns (depending on the needle type, even more)
  • Also possible solder bumps and copper pillars
  • Smallest addressable pitch of the electrical contacts in the range of 40 to 80 micro
  • Lower and more uniform contact resistance in the range of 0.2 to 1.0 ohms (depending on the probe type)

UFO Probe® Vertical

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All benefits of the Probe Card Technology on one view

Progress

The PIC ecosystem can be expanded thanks to an efficient test method for high-throughput serial production; and the test time is reduced thanks to parallel qualification of multiple chips.

Innovation

The only commercial test solution for high-volume production that can run on standard test equipment.

Quality

Scrap is identified at an early stage of production for improved yield: All testing of all PICs can be carried out on a wafer.

Plug and Play

It is designed to operate in standard IC testers and automated testers. Low outlay and commissioning costs.

Efficiency

Fault parts are identified early on for increased yield and optimized production flow.

Flexibility

The pitch and number of optical I/O channels can be configured to suit you.

Enabling optical data communication

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Probe card applications now and in the future

The current UFO Probe® technology is specifically designed for wafer testing of photonic integrated circuits (PICs), especially for optical transceivers. Other applications include: LEDs/micro-LEDs, VCSEL, photo diodes, MEMS mirrors and PCM structures.
Fingerprint Sensor with a thumb

Bio Sensors
Modern technology and computing concept on virtual screen.

Optical quantum chips
3d rendering robotic arms with silicon wafers for semiconductor manufacturing

Process monitoring structures
LiDAR Drohne

Solid State LIDARs
transceiver

Transceiver
fotodiode ufo probe card

Photo Diodes
produktion optoelektronik

Production optoelectronics
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Easy integration into existing test infrastructure

Detailed view of a built-in probe card

Whether if you use a cantilever or vertical version of the UFO Probe® Card, it is intended to be used for operation on standard IC-probers and/or automated test equipment. So, Jenoptik offers a plug-and-play solution for PIC wafer level tests. Depending on requirements, standard interfaces to wafer probers can be easily implemented in the design of the probe cards. The operation of these novel probe cards is similar to that of electrical onces, so existing personnel won't need extensive extra training.

Combination of novel optical concept and proven needle technology
  • Monolithic optical module
  • Alignment-insensitive optical coupling for vertically emitting PICs
  • Simultaneous optical and electrical scanning
  • Optical concept compensates prober alignment tolerances
  • Use of proven needle technology (partnership with test card manufacturers)
  • Standard interface to wafer prober can be implemented

Technical details of the UFO Probe® optoelectronic card

Specifications Current generationFuture generations

Component to be tested
(Device under test/DUT)

Electronic and photonic integrated circuit (EPIC); optical transceivers for data transmission and telecommunications applications

EPIC for transceivers, photodiodes,
biosensors and Solid State LIDAR

Electric needle technology

Cantilever and Vertical

Cantilever, vertical/advanced

Optical coupling principle DUT

Vertical coupling

Vertical coupling

Number of optical inputs/outputs (OI/OO)

Up to 32 or more

<200

Pitch OI/OO

127 μm, 250 μm, flexible for >250 μm

flexible

Layout configuration of OI/OO arrays

Linear arrangement with same direction of inputs/outputs

Configurable to own needs

Coupling angle

0° and 11.6° standard, up to 20° customized

0° - 20°

Supported wavelength

1,310 nm and 1,550 nm

VISto NIR (U-band)

Measurement of insertion loss

Repeatability: ~ 0.3 – 0.5 dB

Repeatability target: 0.1 dB

RF measurement

Up to 110 GHz, depending on needle technology

GHz

Interfaces

European card format

European card format,
ATE interface


Detailed Product Information

For more information please click.

Hybrid technology platform

UFO Probe® Card allows a simultaneous testing of ICs and PICs for an increased yield and reduced testing time.
  • Combines optical and electrical probing
  • Optical module for multiple optical DUT interfaces or multi-DUT tests.
  • Alignment insensitive optical coupling for vertical emitting PICs
  • Cantilever and vertical needle setup as electrical interface to the DUT/ Utilize proven needle technology
For more information please click.

Precise touchdowns save valuable time

UFO Probe® Card´s optical concept compensates prober alignment tolerances to reduce valuable time.
  • RX, TX, alignment channel and comprehensive electrical tests in one single touchdown
  • 1x alignment per batch, no additional alignment per chip
For more information please click.

Relies on existing infrastructure

Enables you to take the next step integrating new technologies as Photonics Integrated Circiuts (PICs) by providing a testing solution that:
  • Works on existing wafer probers and test equipment
  • Can be operated by the same personnel as for conventional electronic testing.
  • Requires no additional effort (training, system adjustment)
  • Design changes to other interfaces possible
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Awarded! Thuringia Innovation Award 2022 for UFO Probe® card

Jenoptik was awarded the Thuringia Innovation Award 2022 in the "Industry & Materials" category on November 30, 2022 in Weimar, Thuringia for its novel opto-electronic probe card for testing PIC wafers. Not quite 100 applications were received by STIFT Thüringen this year. Jenoptik convinced the expert jury with its well-thought-out approach to solving the increasing demand for photonic technologies in the electronics and semiconductor industry.

Do you have any questions? Our experts are happy to help.

Enrico Piechotka

Global Product Group Manager

+49 3641 65-2441

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