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UFO Probe™ card – new test card for PIC wafer testing
Photonic Integrated Circuits (PICs) are the chips of the future. Integrated photonics use light instead of electricity for data and signal processing.
Speed up the world
New challenges for wafer testing
PICs are produced in a wide variety of designs on wafers using classic lithography methods and with existing equipment from established semiconductor manufacturers. The wafers are manufactured in almost the same way as electronic components.
Wafer testing poses its own unique challenge. Due to additional optical components to be tested, the test throughput rates have not yet been achieved as is the case with established IC function tests. Test solutions for visual inspection still have to be procured and integrated, too. A complex realignment of the optical interfaces of the test device in the submicron range is also required for each chip.
A step ahead with Jenoptik
Progress
The PIC ecosystem can be expanded thanks to an efficient test method for high-throughput serial production; and the test time is reduced thanks to parallel qualification of multiple chips.
Innovation
The only commercial test solution for high-volume production that can run on standard test equipment.
Quality
Scrap is identified at an early stage of production for improved yield: All testing of all PICs can be carried out on a wafer.
Plug and Play
It is designed to operate in standard IC testers and automated testers. Low outlay and commissioning costs.
Efficiency
Fault parts are identified early on for increased yield and optimized production flow.
Flexibility
The pitch and number of optical I/O channels can be configured to suit you.
Probe card applications now and in the future
They can easily be integrated into existing test infrastructure
Detailed view of a built-in probe card
UFO Probe™ card allows parallel IC and PIC testing
- Monolithic optical module
- Orientation-insensitive optical coupling for vertically emitting PICs
- Simultaneous optical and electrical scanning
- Use of proven needle technology (partnership with test card manufacturers)
- Standard interface to wafer sampler can be implemented: e.g. European card format
Technical details of the UFO Probe™ optoelectronic card
Specifications | Current generation | Future generations |
Component to be tested | Electronic and photonic integrated circuit (EPIC); optical transceivers for data transmission and telecommunications applications | EPIC for transceivers, photodiodes, |
Electric needle technology | Cantilever | Cantilever, vertical/advanced |
Optical coupling principle DUT | Vertical coupling | Verticalcoupling |
Number of optical inputs/outputs (OI/OO) | Up to 16 | <200 |
Pitch OI/OO | 250 μm | flexible |
Layout configuration of OI/OO arrays | Linear arrangement with same direction of inputs/outputs | Configurable to own needs |
Coupling bracket | 0° and 11.6° | 0° - 20° |
Supported wavelength | 1,310 nm and 1,550 nm | VISto NIR (U-band) |
Measurement of insertion loss | Repeatability: ~ 0.3 – 0.5 dB | Repeatability target: 0.1 dB |
RF measurement | Up to 100 MHz | GHz |
Interfaces | European card format | European card format, |
The UFO Probe™ card in European card format
You can find the video here for an all-round view of Jenoptik’s new test card. Discover the unique technology platform that can also be adapted for other applications.
The modern world needs optical data communication and solutions for efficient manufacturing
Detailed product information
Just one click away from more product details
Want to know more about the ultra-fast optoelectronic UFO Probe™ card? Are you interested in details on technology, markets and applications?Download the product presentation here.
